1. Dual socket P (LGA 3647) supports  Intel® Xeon® Scalable Processors, 3 UPI up to 10.4GT/s

2. Up to 2TB ECC 3DS LRDIMM, up to DDR4-2666MHz; 16 DIMM slots

3. 4 PCI-E 3.0 x16 (double-width) slots,
    2 PCI-E 3.0 x16 (single-width) slots,
    1 PCI-E 3.0 x4 (in x8) slot,
    M.2 Interface: PCI-E 3.0 x4
    M.2 Form Factor: 2280, 22110

4. 8 Hot-swap 3.5" drive bays

5. 2x 10GBase-T LAN ports via Intel X550

6. 1 VGA, 2 COM, 5 USB 3.0

7. 4 Heavy duty fans, 4 exhaust fans, and 2 active heatsink with optimal fan speed control

8. 2200W Redundant Power Supplies Titanium Level (96%)

9. GPU Kit for passive GPU/Coprocessor 
    support (MCP-320-74702-0N-KIT)